By Nate Doughty – Reporter
June 08, 2022, 06:12pm EDT
Canonsburg-based simulation and software company Ansys Inc. announced the release of two new semiconductor products — Totem-SC and PathFinder-SC — that have been built for integration into Ansys’ (NASDAQ: ANSS) big-data platform called SeaScape.
Totem-SC is able to deliver power integrity analysis — the ability to identify problems in a circuit board’s power delivery — for analog, mixed-signal, memory and image sensor designs. Its purpose is to address what Ansys described as the increasing power integrity analysis challenge that’s found in large memory and analog mixed-signal designs.
With PathFinder-SC, Ansys said it “can provide a high-capacity solution” to verify protective circuitry found on all chips within a system to then better protect these chips from electrostatic discharge (ESD) and damage from voltage spikes. The company said that as silicon-based technology continues to shrink, ensuring these critical components are protected from ESD is crucial.
Ansys featured praise for both products from Samsung Electronics in its press release announcing the new technology.
“Power supply noise is a critical metric for our CMOS image sensors as it directly impacts pixel performance,” Seonil Brian Choi, corporate VP of Samsung Electronics, said in the release. “Totem-SC offers us a high-capacity IR signoff solution for Samsung’s high-resolution sensor designs using standard low-memory machines. The high-fidelity results give our team the confidence to maximize design optimization for a better final product.”
As for PathFinder-SS, Samsung Electronics Master VP of Technology Chanhee Jeon said, “”ESD signoff has become increasingly challenging as our design has grown larger and the predictive accuracy requirements have tightened … We have found that PathFinder-SC gives us a high-capacity ESD signoff solution with superior root-cause analysis and multiphysics analysis capabilities, which helps us meet our delivery schedules.”
Ansys claims both products have a significant increase in speed and capacity from their respective predecessors due to their integration into Ansys SeaScape, the company’s big-data platform for distributed processing. This integration, Ansys said, also builds on the company’s plans of adopting open and customizable design platforms capable of multiphysics engineering simulations.
“Designing today’s chips and electronic systems is an increasingly complex multiphysics analysis and simulation problem that requires a broad array of tools to solve,” John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys, said. “Ansys strongly believes in providing open and extensible platforms like SeaScape so our users can use the best tools to simulate, analyze, and optimize their product designs – all the way from early prototyping to manufacturing signoff.”
Source: https://www.bizjournals.com/pittsburgh/inno/stories/profiles/2022/06/08/ansys-releases-two-new-semiconductor-products.html